Please use this identifier to cite or link to this item: https://oar.tib.eu/jspui/handle/123456789/1394
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dc.rights.licenseCC BY 3.0 Unportedger
dc.contributor.authorBehler, Anna
dc.contributor.authorTeichert, Niclas
dc.contributor.authorDutta, Biswanath
dc.contributor.authorWaske, Anja
dc.contributor.authorHickel, Tilmann
dc.contributor.authorAuge, Alexander
dc.contributor.authorHütten, Andreas
dc.contributor.authorEckert, Jürgen
dc.date.accessioned2018-05-22T21:17:30Z
dc.date.available2019-06-28T07:30:58Z
dc.date.issued2013
dc.identifier.urihttps://doi.org/10.34657/4895-
dc.identifier.urihttps://oar.tib.eu/jspui/handle/123456789/1394
dc.description.abstractA thickness dependent exchange bias in the low temperature martensitic state of epitaxial Ni-Mn-Sn thin films is found. The effect can be retained down to very small thicknesses. For a Ni50Mn32Sn18 thin film, which does not undergo a martensitic transformation, no exchange bias is observed. Our results suggest that a significant interplay between ferromagnetic and antiferromagnetic regions, which is the origin for exchange bias, is only present in the martensite. The finding is supported by ab initio calculations showing that the antiferromagnetic order is stabilized in the phase.
dc.formatapplication/pdf
dc.languageeng
dc.publisherNew York : American Institute of Physics
dc.relation.ispartofseriesAIP Advances, Volume 3, Issue 12-
dc.rights.urihttps://creativecommons.org/licenses/by/3.0/ger
dc.subjectMagnetic hysteresis
dc.subjectAtomic force microscopy
dc.subjectMartensitic phase transitions
dc.subjectNickel
dc.subjectExchange interactions
dc.subjectCoercive force
dc.subjectThin film structure
dc.subjectAntiferromagnetism
dc.subjectMagnetic fields
dc.subject.ddc620
dc.titleThickness dependent exchange bias in martensitic epitaxial Ni-Mn-Sn thin films
dc.typearticle-
dc.typeText-
dc.description.versionpublishedVersioneng
local.accessRightsopenAccess-
wgl.contributorIFWger
wgl.subjectIngenieurwissenschaftenger
wgl.typeZeitschriftenartikelger
dc.relation.doihttps://doi.org/10.1063/1.4849795
dcterms.bibliographicCitation.journalTitleAIP Advances-
local.identifier.doihttps://doi.org/10.34657/4895-
Appears in Collections:Ingenieurwissenschaften

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