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Strong Wet and Dry Adhesion by Cupped Microstructures.pdf5,01 MBAdobe PDFView/Open
Title: Strong Wet and Dry Adhesion by Cupped Microstructures
Authors: Wang, Y.Kang, V.Arzt, E.Federle, W.Hensel, R.
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Issue Date: 2019
Published in: ACS Applied Materials and Interfaces 11 (2019), Nr. 29
Publisher: Washington, DC : American Chemical Society
Abstract: Recent advances in bio-inspired microfibrillar adhesives have resulted in technologies that allow reliable attachment to a variety of surfaces. Because capillary and van der Waals forces are considerably weakened underwater, fibrillar adhesives are however far less effective in wet environments. Although various strategies have been proposed to achieve strong reversible underwater adhesion, strong adhesives that work both in air and underwater without additional surface treatments have yet to be developed. In this study, we report a novel design - cupped microstructures (CM) - that generates strong controllable adhesion in air and underwater. We measured the adhesive performance of cupped polyurethane microstructures with three different cup angles (15, 30, and 45°) and the same cup diameter of 100 μm in dry and wet conditions in comparison to standard mushroom-shaped microstructures (MSMs) of the same dimensions. In air, 15°CM performed comparably to the flat MSM of the same size with an adhesion strength (force per real contact area) of up to 1.3 MPa, but underwater, 15°CM achieved 20 times stronger adhesion than MSM (∼1 MPa versus ∼0.05 MPa). Furthermore, the cupped microstructures exhibit self-sealing properties, whereby stronger pulls lead to longer stable attachment and much higher adhesion through the formation of a better seal. © 2019 American Chemical Society.
Keywords: cupped microstructures; polyurethane; self-sealing; two-photon lithography; wet adhesion
DDC: 620
License: CC BY-NC-ND 4.0 Unported
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Appears in Collections:Ingenieurwissenschaften

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