Please use this identifier to cite or link to this item: https://oar.tib.eu/jspui/handle/123456789/4853
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dc.rights.licenseCC BY-NC-ND 4.0 Unportedger
dc.contributor.authorWang, Y.-
dc.contributor.authorKang, V.-
dc.contributor.authorArzt, E.-
dc.contributor.authorFederle, W.-
dc.contributor.authorHensel, R.-
dc.date.accessioned2020-01-14T06:56:42Z-
dc.date.available2020-01-14T06:56:42Z-
dc.date.issued2019-
dc.identifier.urihttp://dx.doi.org/10.34657/124-
dc.identifier.urihttps://oar.tib.eu/jspui/handle/123456789/4853
dc.description.abstractRecent advances in bio-inspired microfibrillar adhesives have resulted in technologies that allow reliable attachment to a variety of surfaces. Because capillary and van der Waals forces are considerably weakened underwater, fibrillar adhesives are however far less effective in wet environments. Although various strategies have been proposed to achieve strong reversible underwater adhesion, strong adhesives that work both in air and underwater without additional surface treatments have yet to be developed. In this study, we report a novel design - cupped microstructures (CM) - that generates strong controllable adhesion in air and underwater. We measured the adhesive performance of cupped polyurethane microstructures with three different cup angles (15, 30, and 45°) and the same cup diameter of 100 μm in dry and wet conditions in comparison to standard mushroom-shaped microstructures (MSMs) of the same dimensions. In air, 15°CM performed comparably to the flat MSM of the same size with an adhesion strength (force per real contact area) of up to 1.3 MPa, but underwater, 15°CM achieved 20 times stronger adhesion than MSM (∼1 MPa versus ∼0.05 MPa). Furthermore, the cupped microstructures exhibit self-sealing properties, whereby stronger pulls lead to longer stable attachment and much higher adhesion through the formation of a better seal. © 2019 American Chemical Society.eng
dc.language.isoeng-
dc.publisherWashington, DC : American Chemical Society-
dc.relation.ispartofseriesACS Applied Materials and Interfaces 11 (2019), Nr. 29-
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/ger
dc.subjectcupped microstructures-
dc.subjectpolyurethane-
dc.subjectself-sealing-
dc.subjecttwo-photon lithography-
dc.subjectwet adhesion-
dc.subject.ddc620-
dc.titleStrong Wet and Dry Adhesion by Cupped Microstructureseng
dc.typearticle-
dc.typeText-
dc.description.versionpublishedVersioneng
local.accessRightsopenAccess-
wgl.contributorINMger
wgl.subjectIngenieurwissenschaftenger
wgl.typeZeitschriftenartikelger
dc.bibliographicCitation.firstPage26483-
dc.bibliographicCitation.lastPage26490-
dc.bibliographicCitation.volume11-
dc.relation.doihttps://doi.org/10.1021/acsami.9b07969-
dcterms.bibliographicCitation.journalTitleACS Applied Materials & Interfaces-
local.identifier.doihttp://dx.doi.org/10.34657/124-
Appears in Collections:Ingenieurwissenschaften

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