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Manova et al 2010, Thin Film Deposition Using Energetic Ions.pdf1.26 MBAdobe PDFView/Open
Title: Thin film deposition using energetic ions
Authors: Manova, D.Gerlach, J.W.Mändl, S.
Publishers Version: https://doi.org/10.3390/ma3084109
Issue Date: 2010
Published in: Materials Vol. 3 (2010), No. 8
Publisher: Basel : MDPI
Abstract: One important recent trend in deposition technology is the continuous expansion of available processes towards higher ion assistance with the subsequent beneficial effects to film properties. Nowadays, a multitude of processes, including laser ablation and deposition, vacuum arc deposition, ion assisted deposition, high power impulse magnetron sputtering and plasma immersion ion implantation, are available. However, there are obstacles to overcome in all technologies, including line-of-sight processes, particle contaminations and low growth rates, which lead to ongoing process refinements and development of new methods. Concerning the deposited thin films, control of energetic ion bombardment leads to improved adhesion, reduced substrate temperatures, control of intrinsic stress within the films as well as adjustment of surface texture, phase formation and nanotopography. This review illustrates recent trends for both areas; plasma process and solid state surface processes. © 2010 by the authors.
Keywords: Ion assisted deposition; Ion implantation; Nanostructures; PVD; Thin films; Deposition technology; High power impulse magnetron sputtering (HIPIMS); Ion Assisted Deposition; Particle contamination; Plasma immersion ion implantation; Substrate temperature; Thin-film depositions; Vacuum arc deposition; Ion bombardment; Ion implantation; Nanostructures; Physical vapor deposition; Plasma applications; Thin films; Vacuum applications; Deposition
DDC: 620
License: CC BY 3.0 Unported
Link to License: https://creativecommons.org/licenses/by/3.0/
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